DSMI group
Originally active in IC sockets, PCB and coaxial connectors, the society DSMI electronics SA has, along the years, diversified its activities. In 2004, DSMI acquired Precicontact and all his manufacturing equipment, processes and stocks. Two years later, DSMI opened an anglage department for watchmaking, a key industrial sector in Switzerland. Meanwhile, DSMI took part in developping a new patented product invented by two young swiss engineers: The SnowPulse Avalanche Air Bags.
Our know-how at your service
We can help you with following:
Subcontracting
You are at full production capacity! Looking for a supplier with ability to do the machining, the assembly and the purchasing of components.
Prototyping
Starting new project! But you don't have the ressources and time to produce samples or prototypes.
Industrialization and mass-production
Looking for a partner able to invest and to find the right methodology to launch the mass-production of your items.
Dicontinuance of activity
You want to defer a product, or a small manufacturing company.
Product range
You are in electronics, clock-making, medical, micromechanics or microtechnics.
PGA IX/IXP
Interstitial PGA Socket
Description
IX / IXP
Interstitial Pin Grid Array Socket and Adapter (Glass Epoxy and Molded Plastic Insulator)
- .100 (2.54) staggered Pin-Grid-Array sockets.
- Available for the most popular devices.
- Sockets are molded in hi-temp LCP material and are surface mount compatible.
- Screw machine contacts feature low insertion and withdrawal force inner contact.
- Custom footprints and Glass-epoxy insulators available (consult the factory).
FIG 1 Soldertail A | FIG 2 Surface Mount |
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ORDERING INFORMATION
U | IX | I | P | 37 | 320 | TL | A | 72 |
Type | Series | Style | Insulator | Grid Size | Number of pins | Plating of Sleeve | * Terminal Style | Plating of Inner Contact |
U - Open Insulator | SMT | Molded Plastic | GH - GoId 10µ" (0.25µm) | See Figure 1 and 2 | 70 - Gold 10µ" (0.25µm) | |||
(Leave Blank for Closed Insulator) | Leave blank for Glass Epoxy | TL - Tin Lead 200µ" (5.08µm) | Soldertail Fig 1 | 72 - GoId 30µ" (0.75µm) | ||||
TB -Tin Bright (SMT) 150µ"( 3.80µm) | A - .090 (2.29)…90231 | 74 - Tin 200µ" (5.08µm) | ||||||
| TF - Tin 200µ" (5.08µm) | B - .120 (3.05)…90238 | 74F - Tin 200µ" (5.08µm) with lubricant | ||||||
SMT pins Fig 2 | **22 - GoId 10µ" (0.25µm) | |||||||
| A - …. …....90232 | **23 - Gold 30µ" (0.75µm) |
* Terminal Style :
For Multilayer PCB with thickness more than 1.6 mm use Soldertail B
For Soldertail B : 090 (2.29) just become .120 (3.05) on Fig 1
Performance Specifications :
| Specifications :
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DSMI electronics SA