PGA IX/IXP

Interstitial PGA Socket

Description

IX / IXP

.100 (2.54) staggered Pin-Grid-Array sockets.
Available for the most popular devices.
Sockets are molded in hi-temp LCP material and are surface mount compatible.
Screw machine contacts feature low insertion and withdrawal force inner contact.
Custom footprints and Glass-epoxy insulators available (consult the factory).

FIG 1 Soldertail A	FIG 2 Surface Mount

ix-32-3.jpg (263058 octets)

ix-32-4.jpg (38456 octets)

U	IX	I	P	37	320	TL	A	72
Type	Series	Style	Insulator	Grid Size	Number of pins	Plating of Sleeve	* Terminal Style	Plating of Inner Contact
U - Open Insulator		SMT	Molded Plastic		Footprint	GH - GoId 10µ" (0.25µm)	See Figure 1 and 2	70 - Gold 10µ" (0.25µm)
(Leave Blank for Closed Insulator)			Leave blank for Glass Epoxy			TL - Tin Lead 200µ" (5.08µm)	Soldertail Fig 1	72 - GoId 30µ" (0.75µm)
						TB -Tin Bright (SMT) 150µ"( 3.80µm)	A - .090 (2.29)…90231	74 - Tin 200µ" (5.08µm)
						TF - Tin 200µ" (5.08µm)	B - .120 (3.05)…90238	74F - Tin 200µ" (5.08µm) with lubricant
							SMT pins Fig 2	**22 - GoId 10µ" (0.25µm)
							A - …. …....90232	**23 - Gold 30µ" (0.75µm)

* Terminal Style :

For Multilayer PCB with thickness more than 1.6 mm use Soldertail B

For Soldertail B : 090 (2.29) just become .120 (3.05) on Fig 1

Inner Contact - BeCu per QQ-C-533
Outer Sleeve - Brass per QQ-B-626
Insulator (Molded) - Liquid Crystal Polymer (LCP) Rated to UL94V-O, color black
Insulator - (Glass Epoxy) - G-10, FR-4, Rated to UL94V-O
Operating Temperature - -65⁰ C to + 125⁰ C
Soldering - lnfared Reflow: 230⁰ C, duration 15 seconds (260⁰ C max.)
All Platings - Over 50µ" (1.27µm) Nickel over 5µ" (0.13µm) minimum Copper
IC Pin Dimension Range - .016 (.041) to .025 (.063) round, .125 (3.18) minimum length

</>