DSMI electronics SA

IC Sockets

PCB connectors

Interconnect Components

Image non disponible

Since 2004, all Precicontact products are manufactured by DSMI electronics SA.

Horlogerie

anglage / perlage / ébavurage / étirage

héritage d'un savoir-faire horloger

Avalanche AirBags

A life-saving mechanism

Image non disponible

DSMI electronics

Precicontact

Watchmaking

Avalanche AirBags

DSMI group

locaux

Originally active in IC sockets, PCB and coaxial connectors, the society DSMI electronics SA has, along the years, diversified its activities. In 2004, DSMI acquired Precicontact and all his manufacturing equipment, processes and stocks. Two years later, DSMI opened an anglage department for watchmaking, a key industrial sector in Switzerland. Meanwhile, DSMI took part in developping a new patented product invented by two young swiss engineers: The SnowPulse Avalanche Air Bags.

Read more about us.

Our know-how at your service

We can help you with following:

Subcontracting

You are at full production capacity! Looking for a supplier with ability to do the machining, the assembly and the purchasing of components.

Prototyping

Starting new project! But you don't have the ressources and time to produce samples or prototypes.

Industrialization and mass-production

Looking for a partner able to invest and to find the right methodology to launch the mass-production of your items.

Dicontinuance of activity

You want to defer a product, or a small manufacturing company.

Product range

You are in electronics, clock-making, medical, micromechanics or microtechnics.

PGA UXP

Print
Molded Pin-Grid-Array Sockets
Description

UXP

Molded Pin Grid Array Socket and Adapter

  • Available for the most popular devices.
  • Sockets are molded in Hi-temp PPS material and are surface mount compatible.
  • Screw machine contacts feature low insertion and withdrawal force inner clips.
  • Options include: molded stand-offs, wire-wrap®, soldertail, adaptor, surface-mount and low-profile termination options.

 

Table 1 C : Adapter Terminal Options

FIG 1

FIG.2

usc-95-1

usc-95-2.jpg (27562 octets)

 

PIN TYPE

FIG

A

B

C

D

E

LOOSE PIN NUMBER

 

FAA

1

.154 (3.92)

.156 (3.95)

.165 (4.20)

.475 (12.07)

.024 (0.62)

3050

FBB

1

.154 (3.92)

.156 (3.95)

.124 (3.15)

.434 (11.02)

.019 (0.48)

3168

FCC

1

.119 (3.02)

.156 (3.95)

.165 (4.20)

.440 (11.17)

.024 (0.62)

3155

FDD

1

.533 (14.05)

.156 (3.95)

.177 (4.50)

.886 (22.50)

.030 (0.76)

3158

BEE

1

.120 (3.05)

.156 (3.55)

.093 (2.35)

.352 (8.94)

.020 (0.50)

3093

BFF

1

.120 (3.05)

.156 (3.55)

.262 (6.66)

.522 (13.26)

.020 (0.50)

3094

AGG

1

.187 (4.75)

.156 (3.95)

.165 (4.20)

.476 (12.10)

.024 (0.62)

3009

FZZ

1

.154 (3.92)

.125 (3.18)

.165 (4.20)

.475 (12.07)

.019 (0.48)

3137

DKK

2

.335 (8.51)

.125 (3.18)

.125 (3.18)

.585 (14.86)

.019 (0.48)

80152

 

Style : Leave blank

Style : W

ux-28-1.jpg (48249 octets)

 PINS 3001-2: E=.360 (9.15)

 PINS 3001-3: E= .500 (12.70)

Style : I

Style : L

ux-28-4.jpg (34330 octets)

ux-28-5.jpg (36278 octets)

 ORDERING INFORMATION

U

A

X

C

P

14

132

TL

A

72

Type

Alternate Footprint

Style

 

Grid Size

Number of Pins

Plating of Sleeve

Terminal Style

Plating of Inner Contact Blank if adapter

U - Open Insulator

  

Leave Blank for Soldertail

  Footprint

GH - Gold 10µ" (0.25µm)

A or See Table 1

70 - GoId 10µ" (0.25µm)

(Leave Blank for Closed Insulator)

  

C - Adaptor

   TL - Tin Lead 200µ" (5.08µm) 

72 - GoId 30µ" (0.75µm)

   

I - SMT

   TB - Tin Lead 180µ" (3.80µm) 74 - Tin 200µ" (5.08µm)
   

L - Low-Profile

   TF - Tin 200µ" (5.08µm) 

74F - Tin 200µ" (5.08µm) with lubricant

   

W - Wire-Wrap®

     

**22 - Gold 10µ" (0.25µm)

         **23 - GoId 30µ" (0.75µm)

 

 Performance specifications:

  • Minimum Duability - 50 cycles
  • Insertion Force - 43g per contact*
  • Withdrawal Force - 23g per contact*
  • **Insertion Force - 22g per contact*
  • **Withdrawal Force - 10g per contact*
  • Maximum Operating Current - 1 Ampere per contact
  • Dielectric Withstanding Voltage - 1000V RMS for 1 Minute
  • Minimum Insulation Resistance - 5000 megohms
  • Pin-to-Pin Capacitance - <0.4pf
  • Contact Resistance - <0.4mW
  • *With .0180 (0.457) Æ Spherical Radius Pin
  • **Special Ultra Low Insertion Force Clip
uxp-31.jpg (46915 octets)

 

Specifications:

  • Inner Contact - BeCu per QQ-C-533
  • Outer Sleeve - Brass per QQ-B-626
  • Insulator - PPS (Ryton TM), Polyphenylene Sulfide Rated to UL94V-O
  • Operating Temperature - -650C to + 1250C
  • All Platings - Over 50µ" (1.27µm) Nickel over 5µ" (0.13µm) Copper
  • Soldering - Infared reflow: 2300C, duration 15 seconds (2600 C max)
  • IC Pin Dimension Range - .016 (0.41) to .025 (0.63) round, .125 (3.18) minimum length

     rohs     reach     eicc   rmi

DSMI electronics SA
Chemin du Stand 1
CH-1914 Isérables