DSMI group
Originally active in IC sockets, PCB and coaxial connectors, the society DSMI electronics SA has, along the years, diversified its activities. In 2004, DSMI acquired Precicontact and all his manufacturing equipment, processes and stocks. Two years later, DSMI opened an anglage department for watchmaking, a key industrial sector in Switzerland. Meanwhile, DSMI took part in developping a new patented product invented by two young swiss engineers: The SnowPulse Avalanche Air Bags.
Our know-how at your service
We can help you with following:
Subcontracting
You are at full production capacity! Looking for a supplier with ability to do the machining, the assembly and the purchasing of components.
Prototyping
Starting new project! But you don't have the ressources and time to produce samples or prototypes.
Industrialization and mass-production
Looking for a partner able to invest and to find the right methodology to launch the mass-production of your items.
Dicontinuance of activity
You want to defer a product, or a small manufacturing company.
Product range
You are in electronics, clock-making, medical, micromechanics or microtechnics.
PGA UX
Glass Epoxy Pin-Grid-Array Sockets
Description
UX
Glass Epoxy Pin Grid Array Socket and Adapter
- Available for all devices.
- Any footprint can be prototyped in less than one week.
- Screw machine contacts feature low insertion and withdrawal force inner clips.
- Options include: Wire-Wrap®, Soldertail, adaptor, surface mount and low-profile options.
Table 1 C : Adapter Terminal Options | |
FIG 1 | FIG.2 |
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PIN TYPE | FIG | A | B | C | D | E | LOOSE PIN NUMBER |
FAA | 1 | .154 (3.92) | .156 (3.95) | .165 (4.20) | .475 (12.07) | .024 (0.62) | 3050 |
FBB | 1 | .154 (3.92) | .156 (3.95) | .124 (3.15) | .434 (11.02) | .019 (0.48) | 3168 |
FCC | 1 | .119 (3.02) | .156 (3.95) | .165 (4.20) | .440 (11.17) | .024 (0.62) | 3155 |
FDD | 1 | .533 (14.05) | .156 (3.95) | .177 (4.50) | .886 (22.50) | .030 (0.76) | 3158 |
BEE | 1 | .120 (3.05) | .156 (3.55) | .093 (2.35) | .352 (8.94) | .020 (0.50) | 3093 |
BFF | 1 | .120 (3.05) | .156 (3.55) | .262 (6.66) | .522 (13.26) | .020 (0.50) | 3094 |
AGG | 1 | .187 (4.75) | .156 (3.95) | .165 (4.20) | .476 (12.10) | .024 (0.62) | 3009 |
FZZ | 1 | .154 (3.92) | .125 (3.18) | .165 (4.20) | .475 (12.07) | .019 (0.48) | 3137 |
DKK | 2 | .335 (8.51) | .125 (3.18) | .125 (3.18) | .585 (14.86) | .019 (0.48) | 80152 |
Style : Leave blank | Style : W |
| See: |
Style : I | |
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ORDERING INFORMATION
U | A | X | C | 14 | 132 | TL | FAA | 72 |
Type | Alternate Footprint | Style | Grid Size | Number of Pins | Plating of Sleeve | Terminal Style | Plating of Inner Contact Blank if adapter | |
U - Open Insulator | Leave Blank for Soldertail | Footprint | GH - Gold 10µ" (0.25µm) | FAA or See Table 1 | 70 - GoId 10µ" (0.25µm) | |||
(Leave Blank for Closed Insulator) | C - Adaptor | TL - Tin Lead 200µ" (5.08µm) | 72 - GoId 30µ" (0.75µm) | |||||
I - SMT | TB - Tin Lead 180µ" (3.80µm) | 74 - Tin 200µ" (5.08µm) | ||||||
L - Low-Profile | TF - Tin d 200µ" (5.08µm) | 74F - Tin 200µ" (5.08µm) with lubricant | ||||||
W - Wire-Wrap® | **22 - Gold 10µ" (0.25µm) | |||||||
| **23 - GoId 30µ" (0.75µm) | ||||||||
Performance Specifications:
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Specifications:
- Inner Contact - BeCu per QQ-C-533
- Outer Sleeve - Brass per QQ-B-626
- Insulator - Glass-filled Epoxy, G-10, FR-4, Rated to UL94V-O
- Operating Temperature - -650C to + 1250C
- Soldering - Wave solder, vapor phase and I.R.
- All Platings - Over 50µ" (1.27 µm) minimum Nickel over 5µ" (0.13µm) minimum Copper
- IC Pin Dimension Range - .016 (0.41) to .025 (0.63) round, .125 (3.18) minimum length, .009 (0.23) x .015 (0.38) to .015 (0.38) x .022 (0.56) rectangular
DSMI electronics SA