ISO
Shrink-Dip Socket .70 (1.78)
Description
Shrink-Dip Socket .70 (1.78) Pitch
- Shrink-DIP sockets .070 (1.78) spacing between contacts.
- Insulator - Glass Epoxy, UL94V-0
- Open insulator with ladder construction.
- Machined outer sleeve with BeCu inner contact.
- Socket pins feature closed-end construction eliminating any solder wicking problems.
Standard Parts | DIMENSIONS (See Fig. 1) | ||||
PART NUMBER | NUMBER OF PINS | A | B | C | D |
| ISO9440028XXXXX | 28 | .980 (24.89) | .500 (12.70) | .400 (10.16) | .094 (2.39) |
| ISO9460042XXXXX | 42 | 1.470 (37.34) | .700 (17.78) | .600 (15.24) | .094 (2.39) |
| ISO9475064XXXXX | 64 | 2.240 (56.90) | .850 (21.59) | .750 (19.05) | .094 (2.39) |
| FIG 1 |
|
ORDERING INFORMATION
ISO | 94 | 75 | 064 | TL | A | 72 |
Series | Thickness of Insulator | DIP Spacing | Number of Pins | Plating of Sleeve | Solder Tail Corresponding | Plating of Inner Contact |
ISO | 94 - .094 (2.39) | 75 | 042 | TL - Tin Lead 200µ" (5.08µm) | Length Loose see Fig 1 | 30 - Gold 10µ" (0.25µm) |
60 | 064 | GH - GoId 10µ" (0.25µm) | E Dim..........Pin Number | 31 - GoId 30µ" (0.75µm) | ||
40 | TF - Tin 200µ" (5.08µm) | A - .118 (3.00) . . . 3164 |
Specifications:
- Inner Contact - BeCu per QQ-C-533
- Outer Sleeve - Brass per QQ-B-626
- Insulator - Glass Epoxy, G-10, FR-4 Rated to UL94V-O
- Operating Temperature - -650C to +1250C
- Soldering - Wave soldering only (1 750C for 15 seconds)
- PCB Thickness - .062 (1.57) to .125 (3.18)
- PCB Hole Size - .035 +/- .003 (0.89 +/- 0.08) solder termination
- All Platings - Over 50 µ" (1.27 µm) minimum Nickel over 5 µ" (013 µm) minimum Copper
- IC Pin Dimension Range - .016 (0.41) to .025 (0.63) round, .125 (3.18) minimum length,
- .009 (0.23) x .015 (0.38) to .015 (0.38) x .022 (0.56) rectangular
- Insertion Force - 186 grams
- Withdrawal Force - 92 grams
- Other : Customs available.
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